Research
- Research
- Back-End Circuit Design
Back-End Circuit Design
Our goal in Back-End Circuit Design is to develop solutions that maximize the performance of components designed for various industries, including mobile, automotive, energy, medical, and environmental fields. We focus on modular design to achieve high integration between components and address challenges related to latency, heat dissipation, interference, and high-speed processing. Also, we aim to create efficient and innovative solutions for optimizing circuit performance and overcoming design challenges in diverse applications.
PCB Module Design
Our focus is on integrating our unique technical expertise with essential design rules. Our objective is to minimize unnecessary waste and maximize efficiency in the PCB design process. We conduct research to minimize noise, power consumption, interference between signal traces, and errors during the design process. Additionally, we explore ways to enhance operational speed, accuracy, modularity, and impedance matching.
PCB Thermal Design
Our goal is to identify and address heat-generating points in high-density PCB layouts. We strategically position components to minimize heat conduction, prevent function degradation or component damage caused by excessive heat, and improve the accuracy of PCB circuit performance.
PCB Design Analysis
Our objective is to improve the methods for assessing whether a designed PCB functions correctly and is free of errors. We conduct in-depth analysis to ensure that the PCB functions as intended, identify and analyze any interference or errors between components and circuits. If any issues arise, we investigate the root causes and explore opportunities for enhancing future designs.